74HC365 DATASHEET PDF

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Datasheet «MC54/74HC365»

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Privacy Policy Koninklijke Philips N. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is dqtasheet at the Buyer’s risk, and that Buyer 74h365 solely responsible for compliance with all legal and regulatory requirements in connection with such use.

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74HC 데이터시트(PDF) – System Logic Semiconductor

This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Buyer will fully indemnify TI and its dataseet against any damages arising out of the use of any TI components in safety-critical applications. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

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The package thermal impedance is calculated in accordance with JESD No rights can be derived from any translation on this website. The “Logic Package Information” document is required to determine in which package s this device is available.

74HC Datasheet(PDF) – NXP Semiconductors

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Analog and mixed-signal devices. TI has discontinued the production of the device. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

74HC/HCT365 Hex Buffer/line Driver; 3-state

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