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Datasheet «MC54/74HC365»

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74HC 데이터시트(PDF) – System Logic Semiconductor

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The package thermal impedance is calculated in accordance with JESD No rights can be derived from any translation on this website. The “Logic Package Information” document is required to determine in which package s this device is available.

74HC Datasheet(PDF) – NXP Semiconductors

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Analog and mixed-signal devices. TI has discontinued the production of the device. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

74HC/HCT365 Hex Buffer/line Driver; 3-state

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