In the backend packaging, the D CoWoS process technology launched by Taiwan Semiconductor Manufacturing Company (TSMC) can. Interposer Technology: Past, Now, and Future. Shang Y. Hou 侯上勇. TSMC 4 years after the 1st CoWoS product. – Huge efforts spent in. The TSMC InFO and CoWoS 3D packaging technologies enable customers to mix multiple silicon dice on a single device and achieve higher.

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Wednesday 31 January In a paper at the recent VLSI Technology Symposium in Kyoto, Japan, the company claimed it had pushed the tzmc of the silicon substrate for the wafer-level system-in-package SiP to mm 2. Although the SiP coupled eight-layer HBM2 memory stacks with a single-layer SoC, TSMC matched the die thickness in the final package to ensure the backsides of all of them cowps have a good interface to heatsinks, to support use in high-performance computing systems.

But until the production actually went into mass production, there was only one main company placing orders — programmable logic device supplier Xilinx Inc. You must be logged in to post a comment.

TSMC’s Unsung Weapon|Industry||CommonWealth Magazine

His willingness to mix it up quickly became clear. The Tessent solution enables 3D IC testing. Countries Prepared for the Future Workplace. The engineering team found encapsulation distributed stress more evenly.

From that point on, the dapper Yu began attending several technology seminars at home and abroad to promote this new home-grown technology. In the backend packaging, the 2. That year, graphics giant nVidia introduced its first graphics processing unit GPUthe GP, to incorporate CoWoS packaging technology, opening the curtain on the more recent artificial intelligence craze. It gives in-depth analyses of their respective market outlooks, with shipment forecasts extending to It reportedly allows “a smooth transition to 3D IC with minimal changes in existing methodologies.


The news immediately rippled through the global semiconductor industry. And the performance of AI chips cowoa be boosted by upgrading the microform technology and changing the transistor structure in the front end, or by incorporating advanced packaging technologies in the back end.

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Mark Li, a senior research analyst at Sanford C. Accordingly, it will be an increasingly important trend for chipmakers to integrate frontend and backend process technologies, Digitimes Research believes, adding that makers must join forces tscm EDA, IP, and IC designers to build a complete ecosystem if they want to secure a preemptive presence in the AIoT artificial intelligence Tskc space. Not long afterwards, Yu suddenly disappeared from view. Usually, an AI architecture will include the upstream cloud computing, midstream edge computing and downstream devices.

Please click here to accept. And those orders were not for just a single iPhone generation, but also for the premium iPhone X cosos hit the market late last year and new models set to come out this year. Easily post a comment below using your Linkedin, Twitter, Google or Facebook account.

Ultimately, however, it was the relatively unsung packaging and testing division that made the difference in helping TSMC put some distance between it and its two closest competitors. Extension Media websites place cookies on your device to give you the best user experience.

In support of CoWoS Synopsys has released enhanced versions of its Galaxy Implementation Platform tools for physical implementation, parasitic extraction, physical verification and timing analysis. Thousands of Bad Wafers Later Yu says that while he was undergoing major changes on the job as he moved into packaging and testing, his family was facing challenges as well and his life hit bottom, but that only further fueled his determination to overcome any challenges that came his way.


TSMC’s Unsung Weapon

The Cwos test tool ” addresses 3D IC multi-die integration challenges including management of placement and routing of micro-bumps, probe-pads, through-silicon-vias TSVsand C4 bumps, accurate extraction and signal integrity analysis of high-speed interconnects between dies, thermal analysis from chip to package to system, and integrated 3D testing methodology for die-level and stacking-level tests”.

Global mobile device shipment forecasts, and beyond: Check the Advanced options to learn the new search rules.

Over the past few years, outside observers closely following the competition between TSMC, Samsung and Intel have focused on advances in dream technologies such as the 7-nanometer process and extreme ultraviolet lithography. Global server shipment forecast and industry analysis, According to Digitimes Research, Taiwan-based server vendors, including suppliers of motherboards, end systems, storage devices and related network equipment, continue to enjoy growth in Please contact us if you have any questions.

But TSMC immediately set its sights on developing an advanced packaging technology that could meet the price without compromising too much on the functions of the CoWoS solutions.

When Chang announced that the global leader in contract chip manufacturing was getting involved in downstream operations, the market started to worry about the future of dedicated packaging and testing suppliers, such as Taiwan-based Advanced Semiconductor Engineering ASE and Siliconware Precision Industry SPIL.

Electrical analysis by the company indicated the stitched lines did not suffer from increased resistance. To define the metal interconnect between then core SoC and as many as six memory stacks, the company used two passes coowos a lithographic stepper with stitching used to continue the interconnects across the reticle boundary.

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